A Flexible Epoxy Resin based Potting Compound with excellent thermal cycling properties.
The General purpose Epoxy Potting Compounds when cured with Polyamine or Polyamide Hardners cures to very hard mass with surface hardness of Shore D 80 and above. This cure will have good mechanical properties but the thermal cycling is very poor which leads to component failure due to stresses developed.
Epofil D –20 is formulated on flexible Epoxy Resin and when cured with Polyamide Hardner cures to a tough ,flexible mass.
The cured compound has
- Excellent Flexibility
- Increased thermal conductivity
- Good Adhesion
- Good Mechanical and Electrical Properties
- Reduced shrinkage and exotherm
- Low coefficient of Linear expansion and less thermal stresses
Physical Properties
| Epofil D-20 | Hardner AMD 160 | |
|---|---|---|
| Type of Compound Hardner | Filled Epoxy* | Polyamide |
| Appearance | Black Viscous liquid | Cl. Yellow liq. |
| Density at 27°C (g/cc) | 1.350 – 1.500 | 0.880 – 0.890 |
| Viscosity by BF at 27 °C (mPa.s) | 12000 ± 4000 | 100 – 600 |
| Storage Stability (months) | 6 | 6 |
Mixing Proportion And Processing
| Properties | Epofil D-20 | Hardner AMD – 160 |
|---|---|---|
| Mixing Parts by Weight | 100 | 25 ± 1 |
| Pot life at 27°C in Minutes | 60- 80 | -- |
Cured System Properties
- Curing
- 1 hour at R.T. + 5 hour at 80°C OR
- 1 hour at R.T. + 12 hour at 60°C
| Properties | Specification |
|---|---|
| Surface | Smooth, Glossy, Flexible |
| Shore Hardness A | 70 - 80 |
| Compression Strength kg/cm2 | 700 - 900 |
| Tensile Strength kg/cm2 | 70 - 80 |
| Elongation % | 20 - 30 |
| Thermal Cycling | OK |
| Electrical Properties | ||
|---|---|---|
| Dielectric Strength (BDV) | kV/mm | > 17 - 20 |
| Dielectric Constant | 3 | |
| Dissipation Factor | Tan δ | 70 X 10-3 |
| Volume Resistivity | -- | 1014 |
| Glass Transition | Temp °C | 95-105 |
| ARC Resistance | -- | > 600 V AC |
| Thermal Shock Resistance | 15 Cycles | -40 to + 150°C |
| Moisture Absorption | -- | < 0.1 % |
Application
- Epofil D - 20 system is suitable for
- Casting, Potting and Sealing of small and medium sized electrical and electronic components
- Potting of instrument transformers
- Cable joint insulation
- Topping of capacitors as sealant
Packing
- Epofil D-20 : 1, 5 and 30 kg container
- Hardner AMD – 160 : 1, 5 and 25 kg container
NOTE: *The filler in the compound has a tendency to settle on long storage. The compound is to be stirred to a homogenous mixture each time it is drawn from the container, before the addition of the Hardner.