Electrocoating & Insulation Technologies Pvt. Ltd. Pune, India

Epoxy Adhesive Epi -Bond

Epoxy Adhesive EPI -BOND is two part system consisting of EPI Bond -A (Resin Part) and EPI Bond - B (Hardner Part). EPI -BOND is a versatile two component adhesive system for high bond strength applications.

Characteristics

  • Excellent adhesion to all materials
  • Cured mass tough and elastic with high resistance to impact stress
  • High adhesive, tensile and share strength
  • Thixotropic flow characteristics, useful for vertical surface
  • Excellent electrical insulating properties

Typical Properties

Properties Unit EPI - BOND A EPI - BOND B
Type Epoxy Resin Polyamide Hardner
Color Hazy Viscous Brownish Yellow
Density at 27°C gm/cc 1.1 - 1.2 0.9 - 1.00
Viscosity by BF at 27°C mPa.s 40,000 - 60,000 45,000 - 55,000
Amine Value mg/KOH/gm ----- 300 - 400
Epoxy Equivalent gm/equivalent 200 - 240 ----

Method of Application

  • Mixing Ratio:
  • EPI BOND A : 100 p.b.w
  • EPI BOND B : 80 p.b.w
  • Gel Time at 25°C : 75 minutes
  • Recommended curing schedule:
  • At 27 °C - 24 hrs
  • At 100 °C - 15 - 25 minutes

Properties Of Cured Compound

  • (Cured FOR 16 hrs AT R T + 4 hrs AT 80°C)
  • Tensile strength N/mm2 : 14 - 15
  • Hardness Shore D : 75 - 78

Instruction To Use

  • For better adhesion it is essential to clean the surface throughly
  • Remove rust, dirt or loose particles
  • Degrease surface by TCE or CTC solvent
  • Dry the surface before application

Filed Of Application

  • Bonding of Magnetic, Ferrites
  • Fixing of break liners
  • Joining wooden and metal patterns

Packing

  • The product is available in 1 kg Polycontainer for Resin & 0.8 kgs for Hardner.