A Filled Epoxy Resin System which cures at room temperature, suitable for Electrical and Electronic Potting / Casting applications.
Epofil – 60 is specially formulated and processed to obtain void free encapsulation and castings. It is a ready to use filled system having low viscosity at processing temperature. The system is modified with special anti settling agents to avoid heavy settling on storage. However the filler settling in the system is very soft and could be re-mixed easily. Epofil – 60 can be used with room temperature curing Hardner –PAM or Hardner – AMD 160 or Heat curing hardners.
The cured Epofil – 60 system has the following characteristics
- Increased thermal conductivity
- Good adhesion to most organic and inorganic materials
- Good mechanical and electrical properties combined with good chemical and water resistance
- Reduced shrinkage and exotherm
- Low coefficient of liner expansion
| Properties | Unit | Specification |
|---|---|---|
| Type of compound | Filled Epoxy | |
| Appearance | Viscous liquid | |
| Density at 27°C | g/cc | 1.500 to 1.600 |
| Viscosity at 27°C DIN Cup 10 | sec | 20-25 |
| Viscosity by BF at 27°C | mPa.s | 3500 ± 500 |
| Storage Stability | 12 months |
Mixing proportion and processing
| Mixing ratio | parts by weight | ||
|---|---|---|---|
| Epofil – 60 | 100 | 100 | |
| Hardner – pam | 5 ± 0.5 | -- | |
| Hardner – amd | -- | 25 ± 1 | |
| Pot life at 25°c | Min | 40 | 65 |
| Temperature rise while Curing (exotherm) | °C | 40 | 35 |
| Hardness | Shore d | 80-85 | 70-74 |
For all epoxy systems the hardners are required to be mixed in Epofil – 60 compound at room temperature and the mixture used within the specified pot life.
Hardner – pam has fast reactivity at room temperature, specially at ambient temperature above 300c. Small mixture quantity of generally less than 1.0 kg. Should therefore be prepared at a time.
Recommended Curing Schedule
- At 20°c - 48 hours
- Or at 30°c - 20 – 24 hours
- Or at 40°c - 16 – 20 hours
Properties of Cured Compound
- Specimen curing : 16 hrs at rt + 4 hrs at 80°c
| Mechanical Properties | Unit | Epofil 60 + hardner pam | Epofil 60 + hardner amd 160 |
|---|---|---|---|
| Flexural strength | N / mm2 | 55 - 60 | 40-45 |
| Compressive strength | N / mm2 | 90 -95 | 60 -65 |
| Impact strength | N / mm2 | 6-8 | 12-14 |
| Tensile strength | N / mm2 | 30-35 | 30-35 |
| Electrical Properties | |||
| Dielectric strength | Kv / mm | 18 | 18 |
| Track resistance | Volt | > 600 | > 600 |
| Dissipation factor | Tan ∂ | 4 x 10-4 | 4 x 10-4 |
| Volume resistivity | Ohm.cm | 1015 | 1015 |
| Dielectric constant | 4.00 | 3.5 | |
Applications
- Epofil – 60 system is suitable for:
- Casting, potting and sealing of small and medium sized
- Electrical and electronic components
- Casting of switch gear components and insulators
- Potting of instrument transformers
- Cable joint insulation
- Topping of capacitors as sealant
Packing
- Epofil – 60 : 1, 5, and 30 kg in metal containers
- Hardner – PAM : 1 and 5 kg polyethylene containers
- Hardner –AMD : 1 and 5 kg polyethylene containers
Note: The fillers in the compound have a tendency to settle on long storage. Epofil – 60, should therefore, be stirred to a homogenous mixture, each time it is drawn from the container, before the addition of the hardner.